The Union Cabinet has cleared a ₹3,706 crore proposal to set up a state‑of‑the‑art semiconductor facility adjacent to the upcoming Noida International Airport in Jewar, Uttar Pradesh. This joint venture between India’s HCL Group and Taiwan’s Foxconn will manufacture display driver chips used in smartphones, laptops, automobiles and medical devices.
Planned within the Yamuna Expressway Industrial Development Authority (YEIDA) zone, the plant’s initial configuration will handle 20,000 wafers per month—translating to an output of up to 36 million chips each month. Commercial production is targeted to begin by 2027.
As the sixth unit sanctioned under the national India Semiconductor Mission, it underscores the government’s drive to reduce import dependence and secure a foothold in the global chip value chain. The facility is expected to directly employ around 2,000 skilled workers and stimulate growth in ancillary industries.
Its proximity to Jewar Airport offers significant logistical advantages, enabling faster inbound raw materials and outbound shipments. The Uttar Pradesh government has pledged capital subsidies and infrastructure support, including power and water connections, to accelerate commissioning.
This collaboration follows earlier, unrealized efforts by Foxconn in India, such as its dissolved partnership with Vedanta. The renewed tie‑up with HCL signals a concerted push to elevate domestic semiconductor manufacturing under “Make in India” and electronics‑hub ambitions.
With rising global demand and strategic incentives, the new plant positions India to compete in critical technology segments. It also lays the groundwork for further expansions, as both HCL and Foxconn explore advanced packaging and chip‑assembly technologies in the coming years.